Erik Hosler Discusses the Economics of Chiplet Reuse and Standardized Interposer Ecosystems

As semiconductor companies look for ways to cut development time and reduce fabrication costs, chiplet reuse is emerging as a compelling economic strategy. By modularizing design into smaller, reusable components, companies can reduce redundancy, streamline verification and scale innovation. Erik Hosler, a strong advocate for scalable packaging platforms, sees how Continue Reading